Pot or encapsulate components
Compare working time, viscosity and documented electrical properties.
Explore PARBONDINDUSTRY / Electronics
Carefully connected.
Electronic assemblies need a balance of handling, protection and material compatibility. Explore selected potting, light-curable and fast-bonding systems, then validate the process on the actual components.
Discuss your application
START WITH THE APPLICATION
Where the connection
takes shape.
Use controlled light curing
Check that light reaches the bond through the chosen substrate.
Explore PARLITEAssemble small components
Review surface condition, adhesive volume and handling time.
Explore PARFIXBUILD A BETTER BRIEF
Four things
to bring to the table.
- 01Component and coating compatibility
- 02Thermal and electrical requirements
- 03Outgassing, blooming and cleanliness requirements
- 04Repairability and cure verification
EXPLORE THE CHEMISTRY
Relevant families.
Cyanoacrylate adhesives
PARFIX®
Small-part bonding, with primers and accelerators where specified.
Explore PARFIX
Epoxy & polyurethane adhesives
PARBOND®
Bonding, seam sealing, potting and encapsulation.
Explore PARBOND
UV-curable adhesives
PARLITE®
Bonding, sealing and coating with a controlled light-curing process.
Explore PARLITECONTACT PARSON
Let’s discuss your application.
Share your materials, joint and process requirements with our India team.
Discuss an applicationsales@parsonadhesives.in