Potting encapsulation
PARBOND 5125
A potting and encapsulating compound with good electrical properties.
Request current TDS
PARBOND FAMILY SHOWN / PACKAGING VARIES BY GRADEPARBOND / Potting encapsulation
PARBOND 340
Low exotherm temperature potting compound.
Request current TDSEpoxy & polyurethane adhesivesIndustrial use
Selection depends on the actual materials, joint and service conditions. Confirm suitability before use.
APPLICATION / SELECTION
What to check
before selecting.
Selection considerations for PARBOND 340
Review the enclosure geometry, component materials and the areas that must remain free of compound. Confirm the filling and curing method, how trapped air will be managed and what electrical, thermal and mechanical checks are required for the finished assembly.
Read the selection guide01 / TECHNICAL OVERVIEW
Technical properties
Typical properties from the available product literature. Values are tied to the stated test conditions and do not replace the current technical data sheet.
| Packing | 50ml 400ml |
|---|---|
| Colour | Amber |
| Viscosity at 25°C, cps | 20,000 – 40,000 cps |
| Working Time (min) | 30 – 50 |
| Fixture Time (min) | 240 – 320 |
| Shear Strength (psi) | 3,000 – 4,000 |
Where data is incomplete or inconsistent across source documents, a value is not shown. Request the current TDS for final selection.
02 / DOCUMENTATION
Request documentation
Request the current TDS, safety data sheet or catalogue. Our team will confirm the relevant document and respond to your enquiry.
Need the current technical data sheet?
Include PARBOND 340 in your application brief and request the current grade-specific documentation.
Request technical dataSAFETY DOCUMENTATIONRequest the safety data sheetConfirm handling, storage and safety information with our team.
PDF / PRODUCT CATALOGUERequest the Parson product catalogueOriginal catalogue • specifications and availability subject to confirmation
03 / BEFORE YOU SPECIFY
A product is part
of a process.
- 01Identify the exact substrates and surface condition.
- 02Define joint geometry, operating conditions and process time.
- 03Review the current TDS and safety data before handling.
- 04Validate the adhesive on representative assemblies.
CONTINUE EXPLORING
Related grades.
All PARBOND productsPotting encapsulation
PARBOND 5894
A potting and encapsulating grade for the electronic industry.
Request current TDSCONTACT PARSON
Make the next
connection.
Tell us how you plan to use PARBOND 340. Share the details that matter to your assembly.
Discuss an applicationsales@parsonadhesives.in