One component epoxy adhesives
PARBOND 5301
One component epoxy adhesives in the PARBOND range. Review the grade’s application details and technical documentation.
Technical data on request
PARBOND FAMILY SHOWN / PACKAGING VARIES BY GRADEPARBOND / One component epoxy adhesives
PARBOND 5720
Flip-chip applications on aluminum antennas.
Request current TDSEpoxy & polyurethane adhesivesIndustrial use
Selection depends on the actual materials, joint and service conditions. Confirm suitability before use.
APPLICATION / SELECTION
What to check
before selecting.
Selection considerations for PARBOND 5720
Confirm storage and handling requirements together with the specified curing process. Check whether the complete assembly can tolerate that process, how adhesive placement will be controlled and how cure will be verified in the actual joint before production use.
Read the selection guide01 / TECHNICAL OVERVIEW
Technical properties
Typical properties from the available product literature. Values are tied to the stated test conditions and do not replace the current technical data sheet.
| Packing | 300ml 20kg |
|---|---|
| Colour | - |
| Viscosity, cps @20 rpm | 30,000- 34,000 cps |
| Cure Schedule | 15 secs @150ºC |
| Overlap Shear Strength (psi) | 2450–2950 |
| Hardness Shore (D) | 84 |
Where data is incomplete or inconsistent across source documents, a value is not shown. Request the current TDS for final selection.
02 / DOCUMENTATION
Request documentation
Request the current TDS, safety data sheet or catalogue. Our team will confirm the relevant document and respond to your enquiry.
Need the current technical data sheet?
Include PARBOND 5720 in your application brief and request the current grade-specific documentation.
Request technical dataSAFETY DOCUMENTATIONRequest the safety data sheetConfirm handling, storage and safety information with our team.
PDF / PRODUCT CATALOGUERequest the Parson product catalogueOriginal catalogue • specifications and availability subject to confirmation
03 / BEFORE YOU SPECIFY
A product is part
of a process.
- 01Identify the exact substrates and surface condition.
- 02Define joint geometry, operating conditions and process time.
- 03Review the current TDS and safety data before handling.
- 04Validate the adhesive on representative assemblies.
CONTINUE EXPLORING
Related grades.
All PARBOND productsCONTACT PARSON
Make the next
connection.
Tell us how you plan to use PARBOND 5720. Share the details that matter to your assembly.
Discuss an applicationsales@parsonadhesives.in