PARBOND 101
Fast cure all purpose adhesive designed to bond a wide variety of surfaces.
Request current TDSPARBOND / PRODUCT RANGE
PARBOND combines epoxy and polyurethane technologies for structural bonding, seam sealing, potting and encapsulation. Its catalogue spans two-component systems, selected one-component epoxies and different working-time and viscosity options for assembly and component protection. Explore the epoxy adhesives range below.
Explore PARBONDFast cure all purpose adhesive designed to bond a wide variety of surfaces.
Request current TDSAll purpose high strength adhesive with 5 min working time. Excellent adhesion to wide variety of surfaces.
Request current TDSAll purpose high performance adhesive with medium cure speed. Excellent adhesion to wide variety of surfaces.
Request current TDSAll purpose high performance adhesive with 30-minute working time. Excellent adhesion to wide variety of surfaces (Low odor version of Parbond 300).
Request current TDSExcellent adhesion on wide variety of surfaces with long working time.
Request current TDSHigh performance industrial assembly adhesive with exceptional durability.
Request current TDSA potting and encapsulating compound with good electrical properties.
Request current TDSRubber toughened, high strength with high peel and shear.
Request current TDSQuick Metal repair and assembly adhesive with high strength.
Request current TDSThis is a 100% reactive epoxy adhesive cures rapidly at room temperature. It’s a metal bonding adhesive which develops high strength in a short time.
Request current TDSA potting and encapsulating grade for the electronic industry.
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