Electronic assembly
PARLITE 4019
UV-curable adhesive. Request current technical data for application selection.
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Electronic assembly
PARLITE includes UV and visible-light-curing adhesives for bonding, sealing, coating, tacking and encapsulation. Catalogue applications cover glass, selected plastics and metals, optical and electronic assembly, windshield repair, and specialist device-component bonding. Explore the electronic assembly range below.
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Product catalogue results
Electronic assembly
PARLITE 4710
High viscosity encapsulant for precision application to specific electronic assembly areas, glob top application.
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PARLITE 4760
Potting, Encapsulating, bonding of electronic parts.
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