PARBOND / PRODUCT RANGE
Potting encapsulation
PARBOND combines epoxy and polyurethane technologies for structural bonding, seam sealing, potting and encapsulation. Its catalogue spans two-component systems, selected one-component epoxies and different working-time and viscosity options for assembly and component protection. Explore the potting encapsulation range below.
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Product catalogue results
Potting encapsulation
PARBOND 5125
A potting and encapsulating compound with good electrical properties.
Request current TDSPotting encapsulation
PARBOND 5894
A potting and encapsulating grade for the electronic industry.
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